FF302 is an extremely etch resistant, low metals material that is well suited for etch processes. While the etchants in your process are intended to remove the dielectric and conductive layers of the wafer, FF302 is designed to withstand even the most aggressive plasmas.
High purity, high performance material technology ideal for high purity elastomer sealing applications that require low particle generation, extremely low extractables and excellent fluid/plasma resistance in aggressive chemistries found in the semicon market.
FF352 is designed to withstand even the most aggressive plasmas used during photoresist removal in both ashing and strip processes.
Parker UHP slit valve doors extend seal life up to 10 times greater than conventional O-rings, delivering unmatched performance and reliability for critical plasma and vacuum systems.
Parker UHP gate valve doors are resistant to extreme plasma attack with increased strength during mechanical actuation.
EZ-Lok™ sealing technology is designed to improve the productivity of existing semiconductor and microelectronics equipment technology by reducing assembly errors and downtime, improving performance, and increasing productivity.
Utilizing years of space flight sealing experience, the division has now perfected the bonding technology on FFKM materials FF200-75, FF202-90, and FF582-90.
Parker FlexiSeal profiles provide reliable flange and gap sealing between chamber and atmospheric pressures in deposition and etch operations. With PTFE’s outstanding chemical compatibility and extremely low friction, our FlexiSeal profiles are engineered to provide long service life in extreme environments.
The Engineered Materials Group from Parker Hannifin develops and manufactures engineered sealing and shielding solutions and is committed to the continued development of high performance materials for the semiconductor industry. Our presence globally allows us to work with OEMs from anywhere in the world as a development partner in designing and engineering new and innovative solutions.
