EZ-Lok™ sealing technology is designed to improve the productivity of existing semiconductor and microelectronics equipment technology by reducing assembly errors and downtime, improving performance, and increasing productivity.
High purity, high performance material technology ideal for high purity elastomer sealing applications that require low particle generation, extremely low extractables and excellent fluid/plasma resistance in aggressive chemistries found in the semicon market.
Utilizing years of space flight sealing experience, the division has now perfected the bonding technology on FFKM materials FF200-75, FF202-90, and FF582-90.
Ultra High Purity (UHP), low extractables and minimal particle generation for high purity semiconductor processing up to 300°C.
FF302 is designed to resist the harsh cleaning gases of the deposition process (i.e., NF3, O2) in order to maximize time between maintenance. It is the ideal solution for improving efficiency and decreasing defects in yield critical deposition applications..
Parker FlexiSeal profiles provide reliable flange and gap sealing between chamber and atmospheric pressures in deposition and etch operations. With PTFE’s outstanding chemical compatibility and extremely low friction, our FlexiSeal profiles are engineered to provide long service life in extreme environments.
Parker UHP slit valve doors extend seal life up to 10 times greater than conventional O-rings, delivering unmatched performance and reliability for critical plasma and vacuum systems.
Parker UHP gate valve doors are resistant to extreme plasma attack with increased strength during mechanical actuation.
The Engineered Materials Group from Parker Hannifin develops and manufactures engineered sealing and shielding solutions and is committed to the continued development of high performance materials for the semiconductor industry. Our presence globally allows us to work with OEMs from anywhere in the world as a development partner in designing and engineering new and innovative solutions.
