The customer shared a PCB with Parker Chomerics, which was then replicated by our experienced Applications Engineering team using an in-house 3D printer.
The 3D printed prototype parts enhanced the five locations for dispensing, so that they could be correctly identified for precise dispense location.
Utilizing a dispensing system from PVA at our state-of-the-art applications engineering lab in Woburn, MA, THERM-A-GAP TC50 was selected for its high thermal conductivity and dispensed onto the 3D printed parts for trials and capabilities. The prototype parts were successful in representing the actual PCB.
The customer visited the applications lab to view the dispensing and determined that THERM-A-GAP TC50, along with the PVA equipment, would be ideal for their high-volume program.
To determine how the extreme temperature conditions would affect THERM-A-GAP TC50, experimentation was run to study the thermal and mechanical properties on the thermal compound. THERM-A-GAP TC50 samples were exposed to the 245°C solder reflow process, and the results concluded that the TI and viscosity did not deviate over the extended time exposure.